CMP conditioners

Flexible fiber conditioners

The flexible fiber conditioner is a brush-based conditioner developed to recover the surface roughness of polishing pads used in the Chemical Mechanical Polishing (CMP) process of semiconductor manufacturing planarization. This is a new concept product that was developed through technical cooperation provided by us from the prototyping stage and joint research with inventors and universities.

Product Variations

Flexible Fiber Conditioner Features

It recovers the surface roughness of polishing pads used in the Chemical Mechanical Polishing (CMP) process of semiconductor manufacturing planarization.
It can condition rigid polyurethane foam pads.
The micro-vibration (self-excited vibration) of the fiber tip produces a finer effect.
When used for rigid urethane foam pads, this product has proven to be more effective in surface conditioning than diamond conditioners with electrodeposited diamond abrasives.
It achieves contamination-free metal.